Wafer dicing is one of the processes popular in the semiconductor industry. It is a method of separating a die from a wafer of semiconductor and this is accomplished using several methods like scribing and breaking, by mechanical sawing, or by laser cutting. Using wafer dicing machine, wafers are cut into individual semiconductor chips, by using dicing blades.
‘Wafer dicing methods’
Scribing and breaking – usually is done in a substrate manufactured from a brittle material where good-quality cutting surface of the substrate may be accomplished without any defects such as chippings on the substrate. This method of semiconductor wafer separation is accomplished by creating a stress in the wafer and then fracturing the wafer across the stress line. A line should be created in the wafer surface across the street where in fact the break is desired.
Mechanical sawing – the procedure is done utilizing a mechanical machine called dicing saw; this method is used for a micro electro-mechanical system semiconductor devices. While you may still find manufacturers that utilize this method, it is slowly getting unpopular because of several disadvantages – the process is slow, contaminant-laden, and dependent on regular shapes.
Laser cutting – a fresh and more effective technology to cut semiconductor materials; the process works by directing the output of a high-power laser at the material to be cut. This process burns or vaporizes away the unwanted parts, leaving an advantage with a high-quality surface finish.
As mentioned above, dicing blades are used and are an important element for the dicing process. There are lots of types of dicing blades plus some of them are the following:
Hubbed Nickel Bonded Blades – that is used to cut Silicon and III-V materials. This blade is ultra-thin and made out of a special electrodepositing technique to hold the cutting diamonds in a nickel alloy matrix.
Dice Tray – with this type of blade, there is no need to buy expensive flanges as the resinoid blade is permanently mounted to its hub. Instead of flanges, once the blade is dressed, it really is detached and reattached again without going through the dressing process.
Hubless Resin Bonden Blades – this type of dicing blade performs very well on materials like ceramic, quartz, sapphire and glass. This may give minimum chipping and superior finish.
Metal Sintered Dicing Blades – that is a type of blade that is created by capturing diamonds in a metal binder using sintering process – it is a very rigid blade and has a very low wear rates. These properties provide ability to create very straight cuts even when subjected to large exposures.